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Fujitsu Limited has transferred its hard disk drive (HDD) business to Toshiba Corporation on October 1st, 2009. Fujitsu drive initializes itself at power-up as follows:
1. Power-up.
2. Self-diagnostics 1:
– data bus and MPU address test
– writing/reading test of microcircuit registers via internal data bus
– internal RAM writing/reading test.
3. Spindle motor start-up.
4. Self-diagnostics 2:
– buffer RAM writing/reading test.
5. Stabilizing the spindle motor rotation speed.
6. Heads release from latch (magnetic heads’ unparking).
7. Service data reading.
8. Recalibration start.
9. Setting itself in readiness mode (ATA command waiting).
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4 Comments
Fujitsu Typical Hard Drive Failure:
VCM (voice coil motor) & SPM (spindle motor) controller malfunction. The microcircuit suffers sometimes from the substrate separation defect and local overheating of the crystal. With such malfunction the drive spins up normally, reports on readiness, operates, and after a while the spindle motor stops (it is a defect similar to TDA5247HT chip in Quantum drives).
Integrated chipset contains a microprocessor in some drive families also including the reading/writing channel and interface controller. Malfunctions of that chip become apparent after circuitry heating (especially in summer period) during writing cycles. As a rule in such cases a drive corrupts its own service modules. One can indirectly judge about the microcircuit operability by activity in data bus lines, connected to ROM and buffer RAM chip. If there is none, you should check the presence of power voltage and clock generation or a steady “RESET” signal. Complete check of integrated chipset requires drive testing using PC-3000 universal utility in cyclic mode with writing enabled for at least 3 full passes. If a drive malfunctions, hangs (does not report on readiness), erases firmware modules, then the circuit is defective. In some cases, this can be corrected by microcircuit unsoldering, solder alloy replacement on board pads and the circuit, flushing the residue of old fusing agent and subsequent soldering the microcircuit back
with obligatory flushing.
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